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:: Rhazer™ Haze Removal System

 

 

 


Haze Removal System

RAVE is once again pioneering another breakthrough in advanced equipment technology with the introduction of the new Rhazer™ Haze Removal System.

Haze contamination on photomasks has become a pervasive and costly problem throughout the Semiconductor Industry. Recent wet clean and environmental control techniques have helped to slow haze formation during wafer stepper exposures, but show no promise of a haze prevention solution.

The Rhazer™ system does not prevent haze, but allows the wafer fab to “manage” it! The Rhazer™ system is designed to reside in the wafer fab and provide a resident capability to completely remove haze from both sides of reticles in less than one working shift. The process is dry and does not require removal of the pellicle. Although haze is expected to reform, the Rhazer™ process causes no damage to the mask absorber materials, meaning reticles can be cleaned as often as needed without leaving the control of the fab line.

The Rhazer™ system can be used to:
Pre-clean masks (providing longer wafer exposure life)
Re-clean masks during wafer stepper lithography runs (quickly returning reticles to the lithography line, increasing line management flexibility and reducing the need for duplicate reticles)
Post-clean masks immediately after use and just before transfer to the reticle stocker to neutralize haze formation during long term storage.

Contact RAVE today at sales@ravenano.com to arrange a Rhazer™ haze removal demonstration.

:: Rhazer™– Performance Specifications
  • Haze Removal: 100% (Without Pellicle Removal)

  • System Throughput: <= 8 hours (Frontside & Backside)

  • Mask Materials: Chrome, MoSi, Quartz.

  • Phase Angle Loss: None

  • Transmission Effect: Minimal

  • CD Variance: <3.0nm (At Best Focus)

  • Mask Size: 150mm x 150mm x 25mm

  • Pellicle Stand-Off: 4mm – 6mm

:: Rhazer™– Key Performance Benefits

  • Time savings:
    • Dry process – No pellicle removal
    • Fast-turn - <= One shift reticle turnaround clean
    • In-fab control – Reticles never leave the wafer fab
    • Fewer cleans – Negligible haze formation in storage


  • Cost-of-Ownership:
    • Very low cost cleans
    • Fewer duplicate reticles needed
    • Significant wafer fab operating savings
    • More efficient lithography line management


  • Extends Reticle Life:
    • No absorber damage
    • Negligible CD variance
    • Clean as often as needed
    • No added chemical residues


  • Green Technology:
    • Small system footprint: 1.25m x 2.34m
    • Low energy consumption: 7kW @ 200-240V AC
    • No harmful effluents or waste management
    • No de-ionized water, acid or solvent wastes


  • Fully Automated Operation:
    • SMIF compatible; RFID reader; OCR/Barcode reader
    • Robot; Pellicle and edge detection; Reticle flipper
    • Highly user friendly GUI software and process control
    • SECS/GEM compatible


 

nanomachining, nanotechnology, photomask repair
E-mail: sales@ravenano.com Rave Nanomachining